IPC-7711/7721

REWORK, MODIFICATION, AND REPAIR OF ELECTRONIC ASSEMBLIES

The IPC-7711/7721 Rework/Repair Modification program covers common rework and repair techniques.

This course provides participants with a hands-on approach to the restoration of electronic assemblies, replacing electronic components, and repairing circuitry with minimum impact on quality and reliability. The course utilises lecture and practical application to teach the rework criteria of the IPC-7711/7721 document.

Course candidates will be taught and shown various skills necessary to perform rework at an advanced level. These include, but are not limited to the following:

  • Demonstrating recommended wire splicing techniques
  • Removing and replacing Plated Through Hole components
  • Removing and replacing Chip SMT components using a variety of methods
  • Removing and replacing J-lead SMT components using a variety of methods
  • Removing and replacing SOIC Gull Wing and SOT SMT components using a variety of methods
  • Pad and Trace repair
  • PCB Laminate repair
  • Coating and Solder Mask repair
  • Jumper Wires

INCLUDED MODULES

AFTER COMPLETION: Students will receive an IPC-7711/7721 Application Specialist (CIS) Certificate, valid for up to two (2) years with an overall score of 70% or better on classroom written exams, as well as demonstrating acceptable soldering techniques using multiple trials. The successful candidate will also receive a PCB to retain after the course.

 

Module 1

  • Overview

Module 2

  • Wire skills

Module 3

  • Thru-Hole Rework

Module 4

  • SMT Chip Style Rework

Module 5

  • SOT and SOIC Rework

Module 6

  • QFP and PLCC Rework

Module 7

  • Printed Wiring Repair

Module 8

  • Laminate Repair

Module 9

  • Conformal Coatings